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在现场微尺度冷,使用聚焦离子束扫描电子显微镜进行冷

Ambra Celotto¹, Randi Holmestad², Filippo Berto³

¹Department of Mechanical and Industrial Engineering, Norwegian University of Science and Technology, Trondheim 7491, Norway.

Micron (Oxford, England : 1993)

|October 1, 2025

概括

微尺度冷成功地连接了不相似的金属,如和铜,而没有表面准备. 这种方法使用塑料变形和剪切力,为电子产品的热辅助连接提供了一个有希望的替代方案.

科学领域:

材料科学材料科学材料科学
制造业工程制造工程
表面科学是一门学科.

背景情况:

微尺度冷工艺为电子元件提供高效的低温连接,保持材料性能.
对不同金属结合机制的有限理解阻碍了工业采用,特别是在微观尺度上.
由于这些局限性,热辅助方法仍然普遍用于微尺度连接.

研究的目的:

开发和演示用于微尺度冷不同金属的试验床程序.
调查结合机制,并确定影响关节质量的因素.
评估这种技术在实际应用中的可行性.

主要方法:

使用聚焦离子束 (FIB) 扫描电子显微镜进行精确的控制和表征.
采用了一种新的方法,将一个圆的铜线推入合金孔中.
进行了横截面分析,元素映射和传输电子显微镜 (TEM).

主要成果:

在没有先前表面准备的情况下,成功地实现了和铜的结合.
通过剪切力观察到显著的谷物精炼和机械去除污染物.
确定FIB残留物作为粘合缺陷的来源;在它们的缺失下形成的统一接口.
通过TEM确认了相互扩散和形成一层薄的Al-Cu金属间层.

结论:

微尺度冷适用于不同金属的连接,通过塑料变形和剪切产生高质量的键.
表面污染物和FIB残留物是影响键完整性的关键因素.
开发的技术显示出在微电子领域及其他领域的工业应用潜力.

关键词:

寒冷接是一种冷.电子显微镜的电子显微镜在FIB-SEM中.微型接微型接微型接微型制造业的微型制造

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