使用第七和第八代粘合剂结合的金属和陶支架的剪接强度的比较评估:一个体外研究
Hemannthee Thota1, Deekshitha Achanta2, Kiran Kumar Dodda3
1Department of Orthodontics, Sibar Institute of Dental Sciences, Guntur, IND.
Cureus
|October 8, 2025
概括
第八代粘合剂和陶正牙支架与第七代粘合剂和金属支架相比,具有更高的剪接强度 (SBS). 这两种粘合剂系统都满足了 ортодонтика支架粘合的临床要求.
科学领域:
- 牙科 牙科是指牙科的专业.
- 生物材料科学 生物材料科学
- 矯正牙科 矯正牙科是一種矯正牙科.
背景情况:
- ортодонтика支架的解仍然是一个临床的挑战.
- 粘合剂的进步旨在提高剪接键强度 (SBS) 和临床结果.
研究的目的:
- 为了比较金属和陶正牙支架的SBS.
- 评估第七和第八代结合剂在正牙结合中的有效性.
主要方法:
- 80个提取的前被用金属或陶支架粘合,使用第七代 (3M ESPE 单键通用) 或第八代 (GC G-Premio BOND) 粘合剂.
- 在人工唾液中储存24小时后,使用通用测试机测量了切割键强度 (SBS).
主要成果:
- 第八代粘合剂 (GC G-Premio BOND) 的SBS显著高 (金属为13.09 MPa,陶为15.17 MPa),而不是第七代粘合剂 (金属为11.54 MPa,陶为13.42 MPa).
- 在两代粘合剂中,陶支架的SBS比金属支架高.
- 所有测试组都超过了足够的结合强度的临床值.
结论:
- 粘合剂生成和支架材料显著影响正牙支架SBS.
- 与第七代剂相比,第八代粘合剂的性能优越,应用简单.
- 两种评估的粘合剂系统都为牙科应用提供了临床上可接受的粘合强度.
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