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在垂直NAND闪存中提高编程效率,使用自助增强的热载体注入.
Moonchurl Kim1, Jiwook Hong2, Choasub Kim3,4
1Department of Display Engineering, Sungkyunkwan University, Suwon, 16419, Republic of Korea.
Scientific reports
|October 14, 2025
概括
热载体注入 (HCI) 为NAND闪存提供了高效的编程. 一种新的双边HCI方法提高了充电注入均性和编程效率,克服了福勒-诺德海姆道的局限性.
科学领域:
- 半导体设备物理 半导体设备物理
- 纳德闪存技术是NAND闪存技术.
- 先进的电子材料先进的电子材料
背景情况:
- 福勒-诺德海姆 (FN) 道工程面临着高压要求和低能效的挑战.
- 热载体注入 (HCI) 为在降低电压下高效编程提供了一个有希望的替代方案.
- 传统的基于自助增强通道的HCI受到程序干扰,非均的充电注入和取决于位置的效率变化的影响.
研究的目的:
- 调查传统基于自助增强通道的HCI的局限性.
- 提出一个新的双边HCI编程 (HCI-BiPGM) 计划.
- 为了提高NAND闪存中的编程效率和统一性.
主要方法:
- 开发一个新的双边HCI编程 (HCI-BiPGM) 计划.
- 横向电场在中心浮动通道区域周围的对称形状.
- 技术计算机辅助设计 (TCAD) 模拟用于性能评估.
主要成果:
- 拟议的HCI-BiPGM方案确保了统一的充电注入和一致的编程效率.
- 与FN道方法相比,实现了大约60%的更高编程效率.
- 证明了改善的电压平衡特性.
结论:
- HCI-BiPGM有效地解决了程序干扰和充电注入不均的问题.
- 这种新的方案提供了卓越的编程效率和位置独立性.
- HCI-BiPGM显示出作为一种先进的低功耗NAND闪存编程技术的潜力.
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