在模拟的露水凝结环境中,SnagCuNi合金的电化学迁移行为
Luntao Wang1, Xuan Liu2, Ziheng Zhao1
1Institute for Advanced Materials and Technology, University of Science and Technology Beijing Beijing 100083 China xiaokui@ustb.edu.cn.
RSC advances
|October 15, 2025
概括
在无合金中添加少量 (0.05-0.10%重量%),可显著提高电化学迁移阻力. 然而,较高的含量会降低这种抗性,影响电子包装的可靠性.
科学领域:
- 材料科学 材料科学 材料科学
- 电化学 电化学 电化学
- 可靠性工程可靠性工程
背景情况:
- 电化学迁移 (ECM) 是电子包装的一个关键故障机制.
- 无合金的使用越来越多,需要了解它们的ECM行为.
- 模拟的露水凝结条件对于在运行压力下评估ECM是相关的.
研究的目的:
- 调查 (Ni) 添加剂对无合金SnagCu (SAC) 的电化学迁移电阻的影响.
- 为了评估SnAgCuNi合金的腐蚀特性和ECM故障机制.
- 为了确定最佳的Ni度以提高合金的可靠性.
主要方法:
- 系统评估腐蚀特性和ECM电阻.
- 电化学测量包括腐蚀潜力,电流密度和电荷转移电阻.
- 在模拟的露水凝结条件下测试.
主要成果:
- 低Ni添加物 (0.05-0.10重量%) 正面转移了腐蚀潜力,降低了腐蚀电流密度.
- 在低Ni添加时观察到电荷转移阻力增加,这表明被动化得到改善.
- 最佳的Ni含量 (0.05-0.10重量%) 抑制了ECM反应速率和减轻了合金腐蚀,增强了SAC305的ECM电阻.
- 较高的Ni含量 (0.25重量%) 显著降低了ECM抗性.
结论:
- 在0.05-0.10重量%的范围内添加,显著提高了SnAgCu合金的电化学迁移阻力.
- 这些发现为防止金属腐蚀迁移和提高电子包装可靠性提供了科学基础.
- 控制Ni含量对于优化无接头的性能和寿命至关重要.
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