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Updated: Jan 15, 2026

A Novel Biaxial Testing Apparatus for the Determination of Forming Limit under Hot Stamping Conditions
07:40

A Novel Biaxial Testing Apparatus for the Determination of Forming Limit under Hot Stamping Conditions

Published on: April 4, 2017

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在受约束和不受约束的负载条件下的积累性滚动粘合 (ARB) Cu/Nb纳米层中的接口旋转,由现场微机械测试揭示

Rahul Sahay1,2, Ihor Radchenko1,3, Pavithra Ananthasubramanian2

  • 1Xtreme Mechanics Laboratory, Engineering Product Development (EPD), Singapore University of Technology and Design (SUTD), 8 Somapah Road, Singapore 487372, Singapore.

Nanomaterials (Basel, Switzerland)
|October 15, 2025
PubMed
概括

在机械测试过程中,铜/ (Cu/Nb) 纳米层呈现出意想不到的接口旋转. 这种在压缩和曲中观察到的新型接口介导的可塑性机制,表明了先进材料设计的内在特性.

关键词:
基于接口的可塑性机制.多层多层的多层.纳米化物是一种纳米化物.的纳米塑性.

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