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Physical Methods for Controlling Microbial Growth: Temperature01:23

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Heat is a widely used method to control microbial growth by targeting and denaturing cellular proteins, thereby killing or inactivating microbes. This method's effectiveness is quantified using parameters such as the thermal death point (TDP), thermal death time (TDT), and decimal reduction time (D value). TDP represents the lowest temperature at which all microorganisms in a liquid suspension are eliminated within 10 minutes, whereas TDT is the time necessary to achieve sterilization at a...

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在CMP中控制低的过程温度控制.

Yeongil Shin1, Jongmin Jeong1, Jiho Shin1

  • 1Graduated School of Mechanical Engineering, Pusan National University, Busan 46703, Republic of Korea.

Materials (Basel, Switzerland)
|October 16, 2025
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概括
此摘要是机器生成的。

过程温度对于在化学机械平面化 (CMP) 过程中控制铜接至关重要. 优化温度可以最大限度地降低排放,确保精确控制高性能半导体中的混合粘合.

关键词:
化学机械平面化 (CMP) 是一种鱼鱼是什么意思 鱼鱼板冷却系统的冷却系统选择性的选择性温度的温度的温度的温度的温度.旋转管的旋转管是什么

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科学领域:

  • 材料科学 材料科学 材料科学
  • 半导体制造业 半导体制造业
  • 化学工程是化学工程的重要组成部分.

背景情况:

  • 高性能半导体需要混合粘合,需要精确的铜控制.
  • 化学机械平面化 (CMP) 对于实现这种控制至关重要.
  • 现有的修改泥或机械的方法已被证明不足以实现最佳的排水控制.

研究的目的:

  • 调查工艺温度对CMP性能的影响.
  • 证明温度在整合CMP的化学和机械方面的作用.
  • 开发一种在CMP中精确控制温度的方法.

主要方法:

  • 评估Cu,Ta和SiO2薄膜的去除速度,使用毯子晶圆实验.
  • 分析了膜去除率作为温度和激活能量的函数 (Arrhenius类型的行为).
  • 开发了一种基于状管的板冷却系统,用于精确调节温度.

主要成果:

  • 薄膜去除率表现出与温度的阿雷尼乌斯类型行为.
  • 30°C的工艺温度平衡了选择性,并最大限度地降低了在有图案的晶圆上摆放的时间.
  • 温度控制减少了分别从12-16nm到4nm和1nm以下的100微米和50微米图案的化.

结论:

  • 工艺温度是CMP的一个关键,但经常被忽视的参数.
  • 精确的温度控制对于管理选择性和最大限度地减少铜是必不可少的.
  • 通过一种新的冷却系统进行了优化温度控制,满足了混合结合的要求.