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在CMP中控制低的过程温度控制

Yeongil Shin1, Jongmin Jeong1, Jiho Shin1

  • 1Graduated School of Mechanical Engineering, Pusan National University, Busan 46703, Republic of Korea.

Materials (Basel, Switzerland)
|October 16, 2025
PubMed
概括

过程温度对于在化学机械平面化 (CMP) 过程中控制铜接至关重要. 优化温度可以最大限度地降低排放,确保精确控制高性能半导体中的混合粘合.

关键词:
化学机械平面化 (CMP) 是一种鱼鱼是什么意思 鱼鱼板冷却系统的冷却系统选择性的选择性温度的温度的温度的温度的温度.旋转管的旋转管是什么

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