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在热循环过程中,木对Sn-Ag-Cu-Bi接接头的微观结构和裂纹传播的影响

C L Hsieh1, R J Coyle2, S A Belyakov1

  • 1Department of Materials, Imperial College London, London, SW7 2AZ UK.

Journal of materials science. Materials in electronics
|October 27, 2025
PubMed
概括

在Sn-Ag-Cu接器中添加石可以提高强度和可靠性. 然而,优化石含量至关重要,以平衡改善的热疲劳阻力与压力转移到金属间层.

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Biasing of Metal-Semiconductor Junctions01:27

Biasing of Metal-Semiconductor Junctions

Biasing metal-semiconductor junctions involves applying a voltage across the junction. Specifically, the metal is connected to a voltage source, while the semiconductor is grounded. This technique is essential for controlling the direction and magnitude of current flow in electronic devices, including diodes, transistors, and photovoltaic cells.
In Schottky junctions, where the semiconductor is n-type, applying a positive voltage to the metal relative to the semiconductor reduces its Fermi...
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