在AlGaN/GaN异构中,AlN盖层对极化库伦场散射的影响 场效应晶体管
Qianding Cheng1,2, Ming Yang1, Zhiliang Gao1,2
1Beijing Orient Institute of Measurement and Test, Beijing 100094, China.
Micromachines
|October 29, 2025
概括
在AlGaN/GaN HFET中的AlN盖层减少了极化散射,增强了电子的移动性. 这种结构优化通过抑制不必要的电荷产生来提高设备性能.
科学领域:
- 材料科学 材料科学 材料科学
- 半导体物理 半导体物理
- 设备工程 设备工程
背景情况:
- 在高功率电子产品中,AlGaN/GaN异构场效应晶体管 (HFET) 是至关重要的.
- 了解散射机制,特别是偏振库伦场 (PCF) 散射,是提高它们性能的关键.
- 盖层在调制设备特性中的作用需要进一步研究.
研究的目的:
- 为了研究AlN盖层对PCF在AlGaN/GaNHFET中的散射的影响.
- 考虑PCF散射和其他机制,量化确定电子流动性.
- 探索AlGaN/GaN HFETs的结构优化策略.
主要方法:
- 用不同的设备大小的AlN和GaN盖层制造AlGaN/GaN HFET.
- 测量电容-电压 (C-V) 和电流-电压 (I-V) 特性.
- 应用二维 (2D) 散射理论用于定量移动性分析.
主要成果:
- 该AlN盖层抑制了AlGaN屏障中的逆压电效应 (IPE),减少了额外的极化电荷 (APC).
- 具有AlN盖层的样本显示出更高的二维电子气体 (2DEG) 密度.
- 由于AlN盖层,PCF的散射强度降低了,其效果不那么依赖于门-排水间距 (L_GD).
结论:
- 该AlN盖层有效地减轻了PCF在AlGaN/GaN HFET中的散射.
- 使用AlN盖层进行结构优化,可以提高电子流动性和设备性能.
- 这项研究为设计先进的AlGaN/GaN HFETs提供了宝贵的见解.
相关概念视频
Biasing of Metal-Semiconductor Junctions
549
Biasing metal-semiconductor junctions involves applying a voltage across the junction. Specifically, the metal is connected to a voltage source, while the semiconductor is grounded. This technique is essential for controlling the direction and magnitude of current flow in electronic devices, including diodes, transistors, and photovoltaic cells.
In Schottky junctions, where the semiconductor is n-type, applying a positive voltage to the metal relative to the semiconductor reduces its Fermi...
In Schottky junctions, where the semiconductor is n-type, applying a positive voltage to the metal relative to the semiconductor reduces its Fermi...
549
π Electron Effects on Chemical Shift: Overview
1.6K
An applied magnetic field causes loosely bound π-electrons in organic molecules to circulate, producing a local or induced diamagnetic field over a large spatial volume. As the molecules tumble in solution, the field generated by π-electrons in spherical substituents results in a zero net field. However, the net field generated by π-electrons in non-spherical substituents is not zero. The effect of this induced field depends on the orientation of the molecule with respect to B0,...
1.6K
Biasing of P-N Junction
1.8K
The operation of a p-n junction diode involves various biasing conditions, including forward bias, reverse bias, and equilibrium.
In equilibrium, no external voltage is applied across the p-n junction. The depletion region is formed at the junction interface due to the diffusion of carriers, which leaves behind charged dopants, acceptors on the p-side, and donors on the n-side. These immobile charges create an electric field that prevents further diffusion of carriers. The related energy band...
In equilibrium, no external voltage is applied across the p-n junction. The depletion region is formed at the junction interface due to the diffusion of carriers, which leaves behind charged dopants, acceptors on the p-side, and donors on the n-side. These immobile charges create an electric field that prevents further diffusion of carriers. The related energy band...
1.8K
MOSFET: Enhancement Mode
779
Enhancement-mode MOSFETs are pivotal components in electronics, distinguished by their capacity to act as highly efficient switches. They are part of the larger family of metal-oxide Semiconductor Field-Effect Transistors (MOSFETs). They are available in two types: p-channel and n-channel, each tailored to specific polarity operations.
In their basic form, enhancement-mode MOSFETs are typically non-conductive when the gate-source voltage (Vgs) is zero. This default 'off' state means no...
In their basic form, enhancement-mode MOSFETs are typically non-conductive when the gate-source voltage (Vgs) is zero. This default 'off' state means no...
779
Biasing of FET
667
Biasing a Junction Field Effect Transistor (JFET) is crucial for setting operational parameters and ensuring efficient functioning in electronic circuits. JFETs are characterized by using a single carrier type in N-channel or P-channel configurations, where the channel is surrounded by PN junctions. These junctions are central to the device's ability to control current flow.
In an N-channel JFET, the structure consists of N-type material forming the channel on a P-type substrate, with the...
In an N-channel JFET, the structure consists of N-type material forming the channel on a P-type substrate, with the...
667
Metal-Semiconductor Junctions
898
The contact of metal and semiconductor can lead to the formation of a junction with either Schottky or Ohmic behavior.
Schottky Barriers
Schottky barriers arise when a metal with a work function (Φm) contacts a semiconductor with a different work function (Φs). Initially, electrons transfer until the Fermi levels of the metal and semiconductor align at equilibrium. For instance, if Φm > Φs, the semiconductor Fermi level is higher than the metal's before contact. The...
Schottky Barriers
Schottky barriers arise when a metal with a work function (Φm) contacts a semiconductor with a different work function (Φs). Initially, electrons transfer until the Fermi levels of the metal and semiconductor align at equilibrium. For instance, if Φm > Φs, the semiconductor Fermi level is higher than the metal's before contact. The...
898


