密集集成的微架构中的热侧通道威胁:对网络物理系统安全性的全面审查
Amrou Zyad Benelhaouare1, Idir Mellal1, Michel Saydé1
1Department of Engineering and Computer Science, University of Quebec in Outaouais, Gatineau, QC J9A 1L8, Canada.
Micromachines
|October 29, 2025
概括
热量是3D-ICs等先进微电子设备的关键安全风险. 本综述绘制了热侧通道攻击和防御的地图,强调了它们对网络物理系统安全的重要性.
科学领域:
- 计算机工程 计算机工程
- 网络安全 网络安全
- 微电子学微电子学
背景情况:
- 密集集成的微架构 (3D-ICs,chiplets,SiP) 将热泄漏从可靠性提升为安全问题.
- 热侧通道攻击 (TSCA) 利用热排放来潜在的数据泄露.
研究的目的:
- 提供关于现代微型架构的TSCA的全面审查.
- 系统化威胁模型,观察矢量和防御策略.
- 强调在网络物理系统 (CPS) 中热安全的重要性.
主要方法:
- 对TSCA现有研究进行系统审查和整合.
- 对过去十年可信证据的分析.
- 针对热泄漏的硬件-软件防御的分类.
主要成果:
- 识别和系统化各种TSCA,它们的攻击载体和威胁模型.
- 在硬件-软件堆中比较了不同防御机制的有效性.
- 强调了热硬化在CPS安全中的重要作用.
结论:
- 热管理是微电子安全的关键方面,而不仅仅是可靠性.
- 对热泄漏防御的进一步研究对于下一代网络安全至关重要.
- 这一审查作为未来在TSCA和CPS安全工作的基础图.
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