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Updated: Jan 13, 2026

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用于高功率光电子设备的烧结.

Hannes Schwan1, Nihesh Mohan1, Maximilian Schmid1

  • 1Institute for Innovative Mobility (IIMo), University of Applied Science Ingolstadt, Esplanade 10, 85049 Ingolstadt, Germany.

Micromachines
|October 29, 2025
PubMed
概括
此摘要是机器生成的。

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新的铜油墨烧结为光电子设备提供了一种经济高效的替代金接剂. 虽然与银的互连相匹配,但它的第一级热性能接近金锡,显示了先进电子包装的前景.

科学领域:

  • 材料科学 材料科学 材料科学
  • 电气工程 电气工程
  • 光电学是指光电子产品.

背景情况:

  • 金-80tin-20 (AuSn) 是光电子组件的标准,因为它的可靠性.
  • 黄金的高成本需要探索用于先进电子包装的替代材料.
  • 基于铜的烧结是一种潜在的低成本,高性能互连解决方案.

研究的目的:

  • 研究用于光电子子模块的新型基于铜的烧结的热性能.
  • 比较无颗粒铜墨水连接器与商业铜,银纳米粒子连接器和AuSn接器.
  • 评估铜烧结用于第一层和第二层互连的可行性.

主要方法:

  • 使用基于复合铜盐的无颗粒铜墨水,使得在现场产生纳米粒子.
  • 在气下以275°C的温度在30MPa压力下烧结连接器15分钟.
  • 进行过渡热分析以评估热性能和机械强度的剪切测试.

主要成果:

  • 实现了均的2-5微米铜层,剪切强度超过31 MPa.
  • 铜油墨接口的热性能与薄的AuSn接口相美,并在第二层相匹配的银联接口.
  • 由于铜层厚度的变化,第一级粘合显示了AuSn和商业糊的优势.
关键词:
铜烧结过程中的铜烧结.光电子产品的光电子产品.短暂的热分析 短暂的热分析

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Last Updated: Jan 13, 2026

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结论:

  • 基于铜的烧结,特别是使用新型无颗粒墨水,是一种可行的,具有成本效益的替代品,用于光电子产品的AuSn接.
  • 优化铜层均性和粘合压力对于提高一级互连性能至关重要.
  • 这项技术在热效率高,价格低廉的光电子设备组装方面具有显著的潜力.