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为先进的灵活电子产品提供三维互连技术

Jun Zhao^1,2, Haokun Yi^1,2, Mengfei Xu^1,2

¹Department of Materials Science, Fudan University, Shanghai, 200433, P. R. China.

Advanced materials (Deerfield Beach, Fla.)

|November 3, 2025

概括

三维 (3D) 灵活电子产品通过垂直集成提供增强的性能和小型化. 本综述探讨了3D灵活互连方面的进展,解决了下一代设备的材料,制造和信号完整性方面的挑战.

科学领域:

材料科学材料科学材料科学
电气工程电气工程
电子工程电子工程

背景情况:

传统的2D灵活电子产品在集成密度和性能方面存在局限性.
三维 (3D) 集成为灵活系统中的小型化和更好的信号完整性提供了解决方案.
为灵活的电子产品开发可靠的3D互连带来了材料,制造和信号管理方面的挑战.

研究的目的:

系统地审查3D灵活互连的最新进展.
检查3D灵活电子产品的材料创新,制造技术和整合策略.
突出应用,并讨论3D灵活电子的未来研究方向.

主要方法:

关于3D灵活互连的最新文献的审查.
对材料创新,制造工艺和整合策略的分析.
检查交叉通话抑制技术和应用示例.

主要成果:

在开发用于3D互连的可拉伸和导电材料方面取得了进展.
针对多层集成的强大的制造工艺正在出现.
正在制定减轻界面压力和信号交叉通话的策略.

结论:

3D集成是灵活电子的转型方法,克服了2D架构的局限性.
解决互连可靠性的挑战对于实现3D灵活系统的全部潜力至关重要.
对材料,制造和设计的持续研究将推动3D灵活电子的进步.

关键词:

3D整合是3D整合.灵活的电子产品灵活的电子产品相互连接的互联网连接.

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