基于物理的2D TMD FET的紧模型,从单个设备到电路的全范围验证.
Dokyoung Lee1,2, Jeongyun Jang1, Jimin Han1
1Division of Electronic and Semiconductor Engineering, Ewha Womans University, Seoul 03670, Republic of Korea. sunghok@ewha.ac.kr.
Nanoscale horizons
|November 10, 2025
概括
一个新的SPICE兼容的2D场效应晶体管 (FET) 的紧型号可以实现高效的电路模拟. 这种基于物理学的模型准确地捕捉了设备的行为,促进了下一代二维半导体电子的设计.
科学领域:
- 材料科学 材料科学 材料科学
- 电气工程 电气工程
- 半导体物理 半导体物理
背景情况:
- 二维 (2D) 半导体,如过渡金属二甲基化物 (TMD),由于其原子薄度和门控制,对先进电子有希望.
- 目前电路设计的局限性源于SPICE模拟中2D场效应晶体管 (FET) 缺乏准确,高效的紧型模型.
研究的目的:
- 开发一个基于物理的,完全分析的,与SPICE兼容的2D FETs的紧模型.
- 为满足在2D半导体电路设计中对强大和计算效率高的建模的需求.
主要方法:
- 开发了一个封闭形式的分析框架,结合了诸如界面陷和移动性退化等物理机制.
- 利用兰伯特W函数的高效近似来避免代解答器和细分.
- 对单个设备和各种集成电路的实验数据验证了模型.
主要成果:
- 在模型和实验数据之间实现了对设备特征和电路动态的定量一致.
- 在模拟逆变器,SRAM单元,NAND门和环振荡器方面证明了模型的忠实性.
- 确保SPICE兼容性,而不会影响准确性或效率.
结论:
- 为2D FETs建立了一个强大的和可扩展的建模方法.
- 成功弥合了2D半导体的设备级物理和系统级电路设计之间的差距.
- 为实际实现基于2DTMD的复杂集成电路铺平了道路.
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