在GaN-on-sapphire pn-diode中直接调查局部泄漏电流
Alexander D Kinstler1,2, Richard Neumann3, Aidan Arthur Taylor4
1Friedrich-Alexander-Universität Erlangen-Nürnberg, Cauerstraße 6, 91058, Erlangen, Germany. Alexander.Kinstler@infineon.com.
Scientific reports
|November 12, 2025
概括
化 (GaN) 装置中的高脱位密度会产生电流泄漏路径. 陷辅助的道穿过杂质的脱位解释了这些泄漏路径,而不是特定的脱位类型.
科学领域:
- 材料科学 材料科学 材料科学
- 半导体物理 半导体物理
- 设备工程 设备工程
背景情况:
- 化 (GaN) 设备的位移会对可靠性和强度产生重大影响.
- 之前的研究已经确定了GaN设备中脱位和当前泄漏路径之间的相关性.
研究的目的:
- 调查反偏向的GaN pn-二极管中泄漏路径的电气和结构性质.
- 了解与位移相关的电流泄漏背后的机制.
主要方法:
- 利用局部电发光 (EL) 信号来研究在蓝宝石基板上生长的GaN pn-二极管中的泄漏路径.
- 与泄漏电流相关联的EL信号,以建模潜在的物理机制.
主要成果:
- 与泄漏电流相关的电流发光 (EL) 信号可以通过在位移处通过分离的杂质进行陷辅助道 (TAT) 建模.
- 缺乏这些特定泄漏路径的设备中的泄漏电流是通过普尔-弗伦克尔 (PF) 和声辅助道 (PAT) 机制建模的.
- 发现反向偏差泄漏不能归因于特定的脱位Burgers向量类型.
结论:
- 在位移处分离的杂质是GaN pn-二极管中泄漏电流的主要原因,可以通过陷辅助道 (TAT) 解释.
- 这项研究区分了设备中的泄漏机制,包括与脱位相关的泄漏路径和不相关的泄漏路径.
- 这些发现挑战了对逆偏差泄漏的历史归因,将其归因于特定的脱位类型.
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