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Updated: Jul 1, 2026

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在低温度和低压下烧结的Ag微粒/Au纳米粒子热接口材料

Krzysztof Stojek1, Adam Krzysztof Nowak1, Olga Rac-Rumijowska1

  • 1Faculty of Electronics, Photonics and Microsystems, Wrocław University of Science and Technlogy, Wyb. Wyspiańskiego 27, 50-370 Wrocław, Poland.

Materials (Basel, Switzerland)
|November 13, 2025
PubMed
概括

研究人员使用银微粒子和金纳米粒子开发了先进的热接口材料 (TIM). 2:1的LC配方在低温烧结后表现出优越的热和机械性能.

关键词:
电子产品的包装电子产品的包装黄金 黄金 黄金 黄金 黄金纳米颗粒是一种纳米粒子.银,银,银,银,银,银,银,银,银,银,银,银,银,银,银,银烧结烧结是因为烧结.热关节 热关节 热关节 热关节热管理 热管理

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