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Updated: Jan 11, 2026

A Simple and Scalable Fabrication Method for Organic Electronic Devices on Textiles

A Simple and Scalable Fabrication Method for Organic Electronic Devices on Textiles

Published on: March 13, 2017

防汗帕利-C封装导电织品用于主动热管理

Shi Hu¹, Dan Wang¹, Mohanapriya Venkataraman¹

¹Department of Material Engineering, Faculty of Textile Engineering, Technical University of Liberec, Studenská 1402/2, 46117 Liberec, Czech Republic.

|November 13, 2025

概括

这项研究开发了Parylene-C涂层铜织品 (CuPET) 用于可穿戴加热. 封装可以防止汗水和腐蚀,提高智能织品的安全性和耐用性.

科学领域:

材料科学材料科学材料科学
织工程织工程织工程
可穿戴技术可穿戴技术

背景情况:

电热织品提供了积极的热管理,但受到金属离子释放和汗水腐蚀的影响.
铜涂布织品 (CuPET) 是有效的加热器,但在潮湿条件下缺乏耐用性.

研究的目的:

开发CuPET的Parylen-C封装策略,以提高耐汗性和长期性能.
评估帕利-C涂层对CuPET的热,电和舒适性能的影响.

主要方法:

在CuPET无布上,Parylen-C薄膜 (4-16μm) 的化学蒸气沉积 (CVD).
形态,舒适性 (空气透性),电热和铜离子释放 (ICP-OES) 分析.
在暴露于人造汗水下进行测试,以评估耐用性.

主要成果:

烯-C涂层有效地保护CuPET免受人造汗水中的铜离子释放 (减少约80%).
涂层织品呈现出快速,均的焦尔加热 (40-45°C在2分钟内在2V下).
空气透性降低了,但保持了可接受的透气性 (3100至1100 L·m-2·s-1).

结论:

烯-C封装提供了一种可扩展和有效的方法,以提高电热织品的安全性,耐用性和热性能.
这种方法可以开发可靠的,主动加热的智能织品,用于先进的绝热.

关键词:

帕利-C封装封装的方法化学蒸气沉积 (CVD) 是一种化学蒸气沉积.有铜涂层的织品电热加热加热电热加热智能可穿戴面料是一种智能可穿戴面料.抗汗能力抗汗能力抗汗能力热绝缘热绝缘热绝缘热绝缘

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