ALDTiSxWSe2

M Saifur Rahman1, Chan-Wen Chiu2, Suzanne E Mohney1,3

  • 1Department of Electrical Engineering, Penn State University PA 16802 USA mqr5905@psu.edu sem2@psu.edu.

RSC advances
|November 21, 2025
PubMed
概括

研究人员使用原子层沉积 (ALD) 为二维半导体开发了高效的孔注入,以创建硫化 (TiSx) 介层. 这一突破解决了一个关键的瓶,使高级逻辑设备具有更好的性能.

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Biasing of Metal-Semiconductor Junctions01:27

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Types of Semiconductors01:20

Types of Semiconductors

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