在ALD培养的半金属TiSx用于将孔注入单层WSe2中
M Saifur Rahman1, Chan-Wen Chiu2, Suzanne E Mohney1,3
1Department of Electrical Engineering, Penn State University PA 16802 USA mqr5905@psu.edu sem2@psu.edu.
RSC advances
|November 21, 2025
概括
研究人员使用原子层沉积 (ALD) 为二维半导体开发了高效的孔注入,以创建硫化 (TiSx) 介层. 这一突破解决了一个关键的瓶,使高级逻辑设备具有更好的性能.
科学领域:
- 材料科学 材料科学 材料科学
- 纳米技术纳米技术
- 半导体物理 半导体物理
背景情况:
- 两维 (2D) 半导体,如过渡金属二甲基化物 (TMDs),显示出对电子的希望.
- 对2D半导体进行高效的孔注入是设备应用的一个主要挑战.
- 半金属接触为n通道场效应晶体管 (FET) 提供低电阻.
研究的目的:
- 研究原子层沉积 (ALD) 用于制造高工作功能的半金属TiSx介层.
- 为了使二维半导体 WSe2.2. 能够有效地注入孔.
- 为了克服高级逻辑节点在2D设备性能上的局限性.
主要方法:
- 使用ALD制造TiSx中间层.
- TiSx与WSe2场效应晶体管 (FET) 的集成.
- 应用MoOx封闭以提高设备性能.
主要成果:
- 在VD=-1V时,实现了~64μAμm-1的孔电流.
- 证明了 10 ± 3 kΩ μm 的接触电阻.
- 在室温下获得了超过106的开/关比.
结论:
- 在ALD中生长的半金属TiSx介层可以有效地将孔注入WSe2.
- 在TiSx中,高工作功能和低密度的状态促进了低的肖特基屏障.
- 接触的范德瓦尔斯性质和MoOx兴奋剂进一步提高了设备的性能.
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