样品制备诱导了从未冷却和冷却的阿贡离子削中软SAC接中的工件
Charlotte Cui1, Bernhard Sartory1, Michael Tkadletz2
1Materials Center Leoben Forschung GmbH, Leoben, Austria.
Scientific reports
|November 21, 2025
概括
五秒激光切除和Ar-ion削提供了先进的微电子样品制备. 削过程中的冷冷却可以最大限度地减少Sn-Ag-Cu接器的表面缺陷,但需要仔细优化参数.
科学领域:
- 材料科学 材料科学 材料科学
- 显微镜的使用方法
- 表面工程是什么?表面工程是什么?
背景情况:
- 由于复杂的材料组合,微电子包装样本的准备具有挑战性.
- 低化的Sn-Ag-Cu (SAC) 器在机械研磨时很容易变形,阻碍了微观结构分析.
研究的目的:
- 为了研究秒激光除与离子削相结合,用于微电子包装的横截面样本准备.
- 为了评估冷却与未冷却的Ar-ion削对Sn-Ag-Cu接微观结构的影响.
主要方法:
- 五秒激光切除用于散装材料的去除.
- 用冷冷却面罩 (在-100°C) 和没有冷却进行最终抛光的离子削.
- 准备好的横截面的微结构分析.
主要成果:
- 不冷却的离子削引入了由于加热和重新放置而导致的表面粗性和丰富的结构等工件.
- 低温冷却显著减少了文物,最大限度地减少了窗和保存微观结构细节.
- 冷却削可能会导致谷物移位,这是由于β-Sn.中的热膨胀异构性.
结论:
- 优化的Ar-ion削参数,包括冷冷却,对于Sn-Ag-Cu合物的高保真微结构分析至关重要.
- 磨削参数的仔细定制是必要的,以平衡缺陷减少与微观结构特征,裂和应变的保存.
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