局部电场定制,以平衡AlGaN/GaN HEMT的电压可靠性,电流密度和高频性能
Yuxin Wang1,2, Jiangwen Wang1,2, Zilong Dong1,2
1Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, Beijing 101400, China.
Micromachines
|November 27, 2025
概括
研究人员开发了一种新的非均复合门介电器,用于化/化高电子移动性晶体管 (AlGaN/GaN HEMT). 这种方法可以提高高频性能,而不会显著损害故障电压,有利于先进的应用.
科学领域:
- 材料科学与工程 材料科学与工程
- 半导体设备物理 半导体设备物理
- 先进的电子材料先进的电子材料
背景情况:
- 高频和高压特征对于工业制造,科学研究和医疗设备中的化/化高电子移动性晶体管 (AlGaN/GaN HEMT) 是至关重要的.
- 当前AlGaN/GaN HEMT的频率和分解特性之间存在显著的权衡,限制了它们在苛刻应用中的性能.
研究的目的:
- 通过使用局部电场定制 (LEFT) 来克服AlGaN/GaN HEMT中的频率分解权衡.
- 通过不均的复合门介电层平衡AlGaN/GaN HEMT的断裂电压和切断频率.
主要方法:
- 使用APSYS-2018软件开发设备模型.
- 设备可靠性的实验验证.
- 使用非统一的复合门介电材料 (例如Al2O3/HfO2,Al2O3/HfZrO) 制造AlGaN/GaN HEMT,并与统一的高k介电材料 (例如HfO2,HfZrO) 进行比较.
主要成果:
- 不统一的复合门介电材料显著改善了传导率,和电流密度 (约. 与传统的均高k介电材料相比,增长了5%),和切断频率 (增长了20.0%35.2%).
- 断裂电压受到最小的影响,保持在均介电对应器的97%以上.
- Al2O3/HfO2和Al2O3/HfZrO结构显示出优越的性能比均的HfO2和HfZrO.
结论:
- 使用非均复合门介电材料的局部电场定制 (LEFT) 策略有效平衡了AlGaN/GaN HEMTs中的高频和高压特征.
- 这种先进的门介电结构显示了诸如工业等离子体发生器,磁共振成像系统和生物医学射频高温装置等应用的巨大潜力.
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