用于SiC双极晶体管和TTL逆变器的SPICE模型由于玛辐射而导致的降解
Alex Metreveli1, Anders Hallén1, Carl-Mikael Zetterling1
1Division of Electronics and Embedded Systems, School of Electrical Engineering and Computer Science (EECS), KTH Royal Institute of Technology, Teknikringen 31, 100 44 Stockholm, Sweden.
这项研究开发了一种SPICE模型,用于碳化物 (SiC) BJT和在玛辐射下的逆变器. 该模型准确地预测了设备退化和电路故障,这对于恶劣环境的电子设备至关重要.
科学领域:
- 材料科学 材料科学 材料科学
- 半导体物理 半导体物理
- 电子工程 电子工程
背景情况:
- 碳化 (SiC) 对于恶劣环境的电子产品至关重要,因为它具有固有的辐射硬度和宽带间隙.
- 了解SiC设备上的辐射影响对于在太空和其他苛刻的应用中可靠运行至关重要.
研究的目的:
- 开发和验证4H-SiC双极连接晶体管 (BJT) 和暴露于玛辐射的TTL逆变器的SPICE模型.
- 为了将材料级辐射诱导的缺陷与电路级性能退化相关联.
主要方法:
- 使用专门的SiC双极工艺制造4H-SiC BJT和TTL逆变器.
- 使用60Co源,对高达800krad的设备进行玛辐射测试.
- 基于VBIC的SPICE模型的校准和改进,使用实验数据 (Gummel图,逆变器特性).
主要成果:
- 实验数据显示BJT的均降解,其特点是电流增益减少和基电阻增加.
- SiC TTL 逆变器一直运行到 600 克拉德 (Si).
- 校准的SPICE模型准确地预测了设备的行为,并推断出一个接近16 Mrad的故障值.
结论:
- 开发的SPICE模型有效地捕捉了SiC BJT和逆变器在玛辐射下的散装和表面降解机制.
- 该模型使SiC集成电路在辐射密集型环境中能够准确设计和寿命预测.
- 与传统相比,SiC技术表现出优越的辐射耐受性,具有延长任务寿命的潜力.
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