取决于温度的逆回收行为分析和超连接 MOSFET 的电路级缓解
Wenrong Cui1, Peng Liao1, Yanghao Wang1
1State Key Laboratory of Integrated Chips and Systems, School of Microelectronics, Fudan University, Shanghai 200433, China.
Micromachines
|November 27, 2025
概括
高温降解超连接金属氧化物半导体场效应晶体管 (MOSFETs) 由于载体寿命的增加. 添加电容器可以通过抑制反向恢复来提高开关可靠性.
科学领域:
- 电气工程 电气工程
- 材料科学 材料科学 材料科学
- 半导体物理 半导体物理
背景情况:
- 超连接 MOSFET 在高功率应用中至关重要.
- 了解它们在高温下的行为对于可靠性至关重要.
- 反复恢复特性显著影响切换性能.
研究的目的:
- 为了研究超连接 MOSFET 中逆回收的温度依赖性.
- 确定高温降解背后的物理机制.
- 提出一种实际的方法来提高设备的可靠性.
主要方法:
- 在不同温度下对超连接 MOSFET 的实验性描述.
- 技术计算机辅助设计 (TCAD) 模拟用于模拟设备行为.
- 对逆回收电荷,电流和切换瞬态的分析.
主要成果:
- 由于严重的逆回收退化,在145°C时观察到开关故障.
- 在更高的温度下增加载体寿命加剧了反向恢复问题.
- 一个并行电容器有效地抑制逆回收,提高可靠性.
结论:
- 温度显著影响超连接 MOSFET 的反向恢复性能.
- 载体寿命是高温降解的关键因素.
- 简单的电容器添加提供了一种可行的策略,可以提高高温电力电子的可靠性.
相关概念视频
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