用于信号完整性分析的坚固型计算机的微电子系统中BGA接接头的热电机械合的多尺度建模
Pan Li1, Jin Huang1, Jie Zhang1
1State Key Laboratory of Electromechanical Integrated Manufacturing of High-Performance Electronic Equipments, Xidian University, Xi'an 710071, China.
Micromachines
|November 27, 2025
概括
这项研究开发了一种多尺度模型,用于在极端条件下分析电机接的热电机械合. 该模型准确地预测了热循环,振动和冲击如何影响可靠性和信号完整性.
科学领域:
- 材料科学 材料科学 材料科学
- 机械工程 机械工程
- 电气工程 电气工程
背景情况:
- 坚固的计算机对于在恶劣环境中运行的关键系统至关重要.
- 球网阵列 (BGA) 接接头中的热电机械 (TME) 合在温度循环,振动和冲击等极端条件下显著影响可靠性.
研究的目的:
- 开发和验证一个多尺度的多物理建模和分析框架,用于BGA接接头在坚固的计算机.
- 综合分析热,电和机械场对接接头和信号传输的影响.
主要方法:
- 提出了一个覆盖系统,主板,接关节和互连层次的多尺度多物理建模框架.
- 对十个热循环条件验证了模型,达到88.89%的准确性.
- 在热循环,随机振动和机械冲击组合下分析了温度分布,应力应变反应和信号完整性.
主要成果:
- 接接头的温度升高会导致热应力和变形,加上电导率的变化.
- TME多物理相互作用导致关键接球中的应力度和塑料应力积累 (最大·米塞斯应力191.51MPa).
- 在928个热循环后,PCIe互连经历了显著的变形 (16.104微米) 和电压降低 (~18.51%).
结论:
- 经过验证的框架为评估和优化微电子系统在坚固型计算机中的可靠性提供了理论基础.
- 了解TME合对于设计用于复杂和极端服务环境的强大系统至关重要.
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