在Cu/SiO2混合结合中Cu-Cu连接的二次化行为的构成模型
Yiming Hao1,2, Si Chen2, Chao Li2
1Institute of Electronics Packing Technology and Reliability, Beijing University of Technology, Beijing 100124, China.
Materials (Basel, Switzerland)
|November 27, 2025
概括
在混合结合中,铜 (Cu) 接头的二次化通过再结晶和粒度生长优化了微观结构. 这提高了粘合质量,但会导致软化,尽管产量强度仍然超过TSV-Cu和散装Cu.
科学领域:
- 材料科学 材料科学 材料科学
- 金工业是金工业的一个方面.
- 纳米技术 纳米技术
背景情况:
- 混合粘合对于先进的包装至关重要,需要强大的铜 (Cu) 接头.
- 化过程显著影响Cu接头的微观结构和机械性能.
- 了解微观结构和机械行为之间的相关性是优化混合结合的关键.
研究的目的:
- 在初级和二级回火后确定Cu-Cu接头的应力-应变构成模型.
- 揭示二次化过程中微观结构和宏观机械性能之间的相关机制.
- 研究二次对混合粘合Cu-Cu接头的机械性能和微观结构的影响.
主要方法:
- 纳米印痕实验被用来探测当地的机械性能.
- 用有限元反向分析来确定应力-应变构成模型.
- 微结构分析的重点是谷粒大小,内核平均误导 (KAM) 和接口形态.
主要成果:
- 二次化 (350-400°C) 促进了再结晶和谷物生长,谷物大小从0.62μm增加到0.71μm.
- 观察到KAM值减少了12%,并增强了接口非平面化,优化了粘合质量.
- 二次回火接头显示软化:弹性模量从131.02降至118.98GPa,硬度从1.78降至1.51GPa,收缩强度从70.52降至56.12MPa.
结论:
- 观察到的软化归因于Hall-Petch效应和二次化过程中的残余应力释放.
- 尽管变软,但二次炼的Cu-Cu接头的强度明显超过了TSV-Cu (31.0%) 和散装Cu (68.5%).
- 二次回火有效地优化了混合粘合应用中的Cu-Cu接头的微观结构和粘合质量.
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