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在高功率VCSEL阵列模块中的快速热阻分布分析.

Dezhen Li1,2, Tian Lan1,2, Zhiyong Wang1,2

  • 1Institute of Advanced Technology on Semiconductor Optics & Electronics, School of Physics and Optoelectronic Engineering, Beijing University of Technology, Beijing 100124, China.

Materials (Basel, Switzerland)
|November 27, 2025
PubMed
概括

高功率的垂直腔表面发射激光 (VCSEL) 由于热阻而面临性能限制. 这项研究迅速确定了包装是主要的瓶,占VCSEL阵列模块总热阻的70%.

关键词:
这是一个VCSEL阵列模块.电气短暂测量 电气短暂测量通过光谱学方法的方法.结构 结构 功能 功能热电阻 热电阻 热电阻

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科学领域:

  • 光电学是指光电子产品.
  • 半导体设备 半导体设备
  • 热管理 热管理

背景情况:

  • 垂直腔表面发射激光器 (VCSEL) 在各种应用中至关重要.
  • 高热阻显著降低了高功率VCSEL阵列模块的性能.
  • 识别热瓶对于提高VCSEL性能至关重要.

研究的目的:

  • 快速分析一个808nmVCSEL阵列模块的热特性.
  • 在高功率VCSEL模块中精确定位包装热阻瓶.
  • 通过解决已识别的热问题来实现更好的性能.

主要方法:

  • 利用电气短暂测量进行非破坏性热分析.
  • 应用了结构函数算法来快速细分热阻组件.
  • 采用光谱技术进行热阻测量的比较验证.

主要成果:

  • 包装热电阻在8A负载电流下占总热电阻的70%.
  • 亚和Rsolder2被确定为主要贡献者,占总热阻的54%.
  • 电气瞬态测量和光谱学得出了可比的总热阻值.

结论:

  • 包装是限制高功率VCSEL阵列模块性能的关键瓶.
  • 结构函数算法为热阻分析提供了一个快速而准确的方法.
  • 这项研究提供了减少热阻和增强VCSEL模块设计的见解.