DFT与NEGF对N型MOSFET的研究相结合,基于2D Bi2C3半导体.
Yongjun Huang1, Jialin Yang1, Weicong Sun1
1Key Laboratory of Advanced Display Materials and Devices, Ministry of Industry and Information Technology, College of Material Science and Engineering, Nanjing University of Science and Technology, Nanjing 210094, People's Republic of China.
二维碳化物 (Bi2C3) 显示出未来电子产品的前景. 这种新型半导体表现出卓越的性能指标,满足半导体国际技术路线图对高性能集成电路的目标.
科学领域:
- 材料科学 材料科学 材料科学
- 凝聚物质物理学 凝聚物质物理学
- 纳米技术纳米技术
背景情况:
- 基于的场效应晶体管 (FET) 正在接近基本的扩展极限.
- 二维 (2D) 材料为克服短通道效应和降低先进晶体管功耗提供了潜在的解决方案.
- 对于下一代半导体设备,正在不断探索新的2D材料.
研究的目的:
- 综合研究新型二维二 bismuth 碳化物 (Bi2C3) 半导体的电子和传输特性.
- 评估单层Bi2C3作为高性能金属氧化物半导体场效应晶体管 (MOSFET) 的通道材料的潜力.
- 根据半导体国际技术路线图 (ITRS) 规范评估设备性能.
主要方法:
- 第一个原则密度函数理论 (DFT) 的计算被用来确定单层Bi2C3.3.的电子带结构.
- 使用非平衡格林函数 (NEGF) 量子运输模拟来建模基于Bi2C3的FET的性能.
- 对各种通道长度进行了设备模拟,包括10nm和5nm.
主要成果:
- 单层Bi2C3表现出适度的直接带隙,利的导电带,以及低的电子有效质量 (0.48m0).
- Bi2C3 FET实现了2540μA/μm的超高启动状态电流 (离子),在10纳米通道的开/关比超过10^4.
- 设备展示了快速切换速度,低功率延迟 (τ) 和优秀的能量延迟产品,满足ITRS在缩放的通道长度上的高性能目标.
结论:
- 单层Bi2C3是未来高性能集成电路的极具竞争力的候选材料.
- 基于Bi2C3的FET的全面性能指标满足了高级半导体应用的关键要求.
- 这项研究提供了使用DFT-NEGF模拟在MOSFET中的Bi2C3潜力的第一个系统评估.
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