提高分辨率利用率用于DIC测量使用剪切成像的纤细元件
Yinhang Ma1, Kangjiang Lv1, Zhuoxuan Song1
1School of Mechanical and Electronic Engineering, Nanjing Forestry University, Nanjing 210037, China.
Sensors (Basel, Switzerland)
|December 11, 2025
概括
一种新的虚拟多摄像头数字图像相关联 (DIC) 方法使用迈克尔森剪切装置来提高细小的组件的分辨率利用率. 这种具有成本效益的方法可以在没有额外的摄像头的情况下进行高分辨率的变形测量.
科学领域:
- 机械工程 机械工程
- 光学测量技术的使用
- 材料科学 材料科学 材料科学
背景情况:
- 数字图像相关性 (DIC) 是全场变形测量的一个关键技术.
- 苗条的组件往往由于其高面积比低,无法充分利用DIC的空间分辨率.
- 现有的方法可能需要复杂的设置或额外的摄像头来进行高分辨率测量.
研究的目的:
- 提出一种新的虚拟多摄像头DIC方法,用于在细部件测量中提高分辨率.
- 提高DIC系统在受限制环境中的成本效益和实用性.
- 为了实现高分辨率的全场形态和变形测量精细的组件.
主要方法:
- 集成传统的双摄像头设置与两个迈克尔森剪切装置 (MSD).
- 每个MSD将组件的图像分割,将分段投射到相同的传感器上以增强分辨率.
- 系统校准以确定外部参数,用于合来自不同地区的3D数据.
主要成果:
- 通过翻译和曲测试成功进行实验验证.
- 实现了精确的全场形态和变形测量.
- 在重叠的测量区域中证明了子像素级别的协议.
结论:
- 拟议的虚拟多摄像头DIC方法有效地提高了精细元件的分辨率利用率.
- 这种方法为高分辨率的DIC测量提供了实用且具有成本效益的解决方案.
- 该方法克服了传统DIC在测量高比例结构方面的局限性.
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