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使用先进电子包装金属被动化技术提高低温Cu-Cu粘合的热稳定性

Mu-Ping Hsu¹, Tai-Yu Lin¹, Hua-Jing Huang²

¹Institute of Electronics, National Yang Ming Chiao Tung University, Hsinchu, Taiwan.

Communications engineering

|December 13, 2025

概括

添加薄的银色被动化层可以实现可靠的低温铜-铜结合. 这种先进的包装技术提高了恶劣环境中的热稳定性和耐用性,克服了传统高温方法的局限性.

科学领域:

材料科学材料科学材料科学
纳米技术纳米技术
半导体制造业半导体制造业

背景情况:

传统的铜-铜结合需要高温 (≥250°C),导致热应力和工艺限制.
这给多芯片堆叠和先进包装集成带来了挑战.

研究的目的:

为了研究铜-铜结合的热稳定性,使用薄的银色被动化层.
为了实现先进的包装应用,可靠的低温粘合.

主要方法:

在铜上引入3纳米的银色被动化层.
高速压力测试 (HAST) 和燃烧测量用于耐用性评估.
在现场传输电子显微镜 (TEM) 和4D-STEM菌株映射用于接口分析.

主要成果:

在较低的温度下实现可靠的粘合,增强耐用性.
沿铜颗粒边界的银色扩散抑制了异常的颗粒生长,并减少了界面空隙.
与非被动粘合相比,保持了稳定的接口和优越的机械强度.

结论:

金属被动化,特别是与银,对于使低温铜-铜结合至关重要.
这项技术提供了强大的热稳定性和下一代先进包装的可行性.
银被动化提高了铜互连的可靠性和性能.

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