一种基于数字双胞胎的热压缩粘合电极中三维热疲劳裂纹的新预测方法

Qianyu Ren1, Kai Yang1, Zuoen Deng1

  • 1Key Laboratory of Advanced Manufacturing Technology of the Ministry of Education, Guizhou University, Guiyang, China.

PloS one
|December 16, 2025
PubMed
概括

本研究引入了一个数字双胞胎 (DT) 框架,结合基于物理的模拟和人工智能,准确预测热压缩粘合 (TCB) 电极的3D裂,提高电子制造的可靠性.

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