:

Hang Shi1,2, Xuancheng Li1,2, Ting Liang3

  • 1Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China.

PubMed
概括

带有球形填充剂的热接口材料 (TIM) 显示出意想不到的高热接触电阻 (TCR). 富含聚合物的界面层显著限制了电子设备的散热,尽管其散热导电性很高.