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基于颗粒吞没印刷的软电子产品

Rongzhou Lin1,2, Chengmei Jiang3,4,5, Sippanat Achavananthadith3

  • 1School of Mechanical and Automotive Engineering, South China University of Technology, Guangzhou, China.

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|December 18, 2025
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此摘要是机器生成的。

研究人员开发了一种新方法,可以将功能粒子直接嵌入到可伸缩电子产品的软聚合物中. 这种颗粒吞技术简化了制造,并使先进的电子设备功能成为可能.

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科学领域:

  • 材料科学 材料科学 材料科学
  • 聚合物科学 聚合物科学
  • 电子工程 电子工程

背景情况:

  • 可拉伸电子需要将功能粒子集成到软聚合物矩阵中.
  • 目前的制造方法涉及液体分散,这给材料兼容性和流体力学控制带来了挑战.

研究的目的:

  • 引入一种用于直接将颗粒纳入软聚合物的新方法.
  • 克服可拉伸电子材料传统制造技术的局限性.

主要方法:

  • 使用颗粒吞,其中颗粒被表面能量驱动的聚合物矩阵自发地吞.
  • 确保颗粒大小小于聚合物的弹性毛囊长度,以确保稳定的嵌入.
  • 制造多层,多材料的弹性装置.

主要成果:

  • 在软聚合物中成功地将功能性颗粒直接纳入软聚合物.
  • 通过深入嵌入的粒子实现了能量稳定的配置.
  • 具有无线传感,通信和功率传输能力的制造功能设备.

结论:

  • 颗粒吞为制造先进的可拉伸电子材料提供了一种简化和有效的方法.
  • 这种方法扩大了创建具有增强功能的复杂,集成电子设备的可能性.