高功率密度化无线电频率晶体管通过增强核化在 heteroepitaxy 中
Hong Zhou1, Chaoqun Zhang1, Kun Zhang1
1State Key Discipline Laboratory of Wide Bandgap Semiconductor Technology, School of Microelectronics, Xidian University, Xi'an, China.
Nature communications
|December 18, 2025
概括
我们开发了一种离子植入技术,以改进高电子移动性化 (GaN) 晶体管 (HEMT). 这种方法显著降低了热阻,并提高了先进的无线电频率应用的功率密度.
科学领域:
- 材料科学 材料科学 材料科学
- 半导体物理 半导体物理
- 电气工程 电气工程
背景情况:
- 高电子移动性化 (GaN) 晶体管 (HEMT) 对于高频,高功率射频 (RF) 应用至关重要.
- 由于高热电阻和厚厚的化物层,GaN HEMT 的输出功率密度已经平稳.
- 现有的GaN表层氧化方法在热管理和层厚度控制方面存在局限性.
研究的目的:
- 通过解决热电阻和层厚度来克服GaN HEMT性能方面的局限性.
- 在碳化 (SiC) 基板上引入一种新的核化策略,以改善GaN表.
- 为了提高基于GaN的射频设备的输出功率密度和运行频率.
主要方法:
- 在碳化 (SiC) 基板上实施离子植入,以创建诱导核化场所.
- 利用纳米到微尺度的表面核化场所来抑制传统的岛屿样核化.
- 实现了快速的薄膜凝聚和降低缓冲层厚度,同时保持低位移密度.
主要成果:
- 达到了3.9m2K/GW的低热阻记录,用于表轴堆,这是三倍的改进.
- 证明了GaN晶体管的20.6 THz·V的纪录约翰逊的价值观.
- 在8 GHz实现了42 W/mm的输出功率密度,在30 GHz实现了20 W/mm的输出功率密度,显著改善.
结论:
- 离子植入诱导核化策略有效地增强了RF电子器件的GaN表.
- 这种方法为突破GaN HEMT现有的性能上限提供了一个有希望的途径.
- 取得的结果为下一代高性能射频设备铺平了道路.
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