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Updated: Jan 8, 2026

Accumulation and Analysis of Cuprous Ions in a Copper Sulfate Plating Solution
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Accumulation and Analysis of Cuprous Ions in a Copper Sulfate Plating Solution

Published on: March 20, 2019

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扣层,装饰的正方形-卡戈梅系统 KCu7BiO4(SO4) 5

Larisa V Shvanskaya1,2, Tatiana D Bushneva1, Dmitriy A Chareev3

  • 1Moscow State University, Moscow 119991, Russia.

Inorganic chemistry
|December 18, 2025
PubMed
概括

我们合成了KCu7BiO4(SO4) 5 ,这是一个新的装饰方形kagome材料. 这种化合物在12K时表现出复杂的磁性行为,具有远程顺序,表明显著的磁性挫折.

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