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Updated: Jan 8, 2026

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
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单模VCSEL采用环形金属开口用于横向封闭和芯片上的光束成形技术

Yuehui Xu, Jianwei Zhang, Tianjiao Liu

    Optics express
    |December 19, 2025
    PubMed
    概括

    本研究介绍了一种新型的表面微结构垂直腔表面发射激光器 (VCSEL),可以保持高光束质量的单模式运行. 该设备有效地抑制了在广泛的温度范围内的热模式跳转和侧模式降解.

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    Biasing of Metal-Semiconductor Junctions01:27

    Biasing of Metal-Semiconductor Junctions

    Biasing metal-semiconductor junctions involves applying a voltage across the junction. Specifically, the metal is connected to a voltage source, while the semiconductor is grounded. This technique is essential for controlling the direction and magnitude of current flow in electronic devices, including diodes, transistors, and photovoltaic cells.
    In Schottky junctions, where the semiconductor is n-type, applying a positive voltage to the metal relative to the semiconductor reduces its Fermi...
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