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Phase Contrast and Differential Interference Contrast Microscopy01:26

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Phase-Contrast Microscopes
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电光,光子和微光系统的被动对齐平台.

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    此摘要是机器生成的。

    本研究介绍了一个被动对齐平台,用于可扩展的芯片集成,使电光系统的快速和可靠的组装. 这种方法克服了主动对齐的局限性,降低了先进的电子和光子包装的成本和复杂性.

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    科学领域:

    • 光子学和电子学 集成 整合
    • 半导体包装技术 半导体包装技术
    • 纳米尺度对齐系统的系统.

    背景情况:

    • 基于芯片的系统的大规模集成对于未来的光子和电子应用至关重要.
    • 目前的纳米级对齐方法 (主动对齐) 是缓慢而昂贵的,阻碍了可扩展性.
    • 需要有效且具有成本效益的被动对齐解决方案.

    研究的目的:

    • 为快速,可靠和可扩展的电光系统组装开发一个被动对齐平台.
    • 为了证明芯片对芯片光学互连的被动对齐的可行性.
    • 为了降低与高精度芯片组装相关的成本和复杂性.

    主要方法:

    • 开发一个晶圆尺度的被动对齐平台,使用弹性平均化方案.
    • 在芯片背面制造对齐结构.
    • 芯片对芯片对齐准确度和光学链路损失的表征.

    主要成果:

    • 在芯片之间实现了260nm的横向对齐和240nm的高度对齐.
    • 证明了芯片对芯片的光学链路损失为-2.4dB.
    • 弹性平均化方案提供了一个强大的被动对齐解决方案.

    结论:

    • 开发的被动对齐平台使电光系统的快速,可靠和可扩展组装成为可能.
    • 这种方法为芯片集成提供了积极对齐的成本效益高的替代方案.
    • 该技术适合在先进的光子和电子包装中大规模实施.