在超高门电压脉冲应力下分析SiC MOSFET的门氧化物不稳定性
Jingjing Tan1, Hang Xu1, Jianbin Guo1
1College of Integrated Circuits and Micro-Nano Electronics, Fudan University, Shanghai 200433, People's Republic of China.
Nanotechnology
|December 19, 2025
概括
碳化 (SiC) MOSFETs通过极端门电压脉冲下与孔相关的电荷捕获而降解. 这项研究揭示了正脉冲和负脉冲的特定降解路径,指导了功率电子产品中设备强度的提高.
科学领域:
- 电力电子 电力电子 电力电子
- 半导体设备物理 半导体设备物理
- 材料科学 材料科学 材料科学
背景情况:
- 碳化 (SiC) 金属氧化物半导体场效应晶体管 (MOSFET) 对于高功率应用至关重要.
- 在极端静电放电 (ESD) 事件下,特别是超高门电压脉冲下,它们的可靠性尚未得到充分理解.
研究的目的:
- 系统地评估SiC MOSFET在超高门脉冲应力下的可靠性.
- 阐明主要的降解机制和途径.
- 为提高SiC MOSFET强度提供见解.
主要方法:
- 制造SiC MOSFETs. 这是一个很好的例子.
- 使用超高门电压脉冲 (正负) 进行系统可靠性测试的应用.
- 对值电压 (Vth) 的变化和电荷捕获现象的分析.
主要成果:
- 与孔相关的电荷捕获被确定为正负门应力的主要降解机制.
- 阳性脉冲导致由于孔注射而导致非单调的Vth转移.
- 负脉冲导致从洞捕获和捐赠者类陷形成的Vth迅速减少.
- 氧化物分解归因于电场应力.
结论:
- 在极端门脉冲应力下,SiC MOSFET的降解主要是由与孔相关的电荷捕获.
- 了解这些特定的降解途径对于提高设备可靠性至关重要.
- 这些发现为设计更强大的SiC MOSFET用于要求高功率电子应用提供了实际指导.
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