在β-Ga2O3 MOSFET中通过等离子处理调节缺陷介导的门电压
Lisheng Wang1, Yifan Zhang1, Junxing Dong1
1State Key Laboratory of Optoelectronic Materials and Technologies, School of Physics, Sun Yat-Sen University, Guangzhou 510275, China.
Nanomaterials (Basel, Switzerland)
|December 24, 2025
概括
氧化物 (β-Ga2O3) 功率装置的处理,通过等离子体辅助分子束表 (PA-MBE) 生长,显著抑制泄漏电流并增强故障电压. 这种方法可以实现有效的门电压工程,以提高设备性能.
科学领域:
- 宽带差距半导体研究研究
- 氧化 (Ga2O3) 在功率电子中使用.
- 基于等离子体的表面修饰方法
背景情况:
- 由于其优越的性能,β-Ga2O3是下一代动力电子产品的一个有前途的材料.
- 表面状态和β-Ga2O3中的缺陷限制了设备的性能,特别是状态外的泄漏和故障电压.
- 等离子体辅助分子束表 (PA-MBE) 是种植高质量的β-Ga2O3表层的关键技术.
研究的目的:
- 通过CF4 - 血治疗对β-Ga2O3 MOSFETs进行 (F) 结合的影响.
- 为了抑制类似捐赠器的表面状态,并改善设备性能指标,如离位电流和故障电压.
- 在β-Ga2O3电源设备中实现可控制的门电压工程.
主要方法:
- 使用等离子体辅助分子束表层 (PA-MBE) 的β-Ga2O3表层的生长.
- 优化CF4-等离子处理,将引入近表面区域.
- 设备制造和MOSFET的特征,包括电气测量和X射线光电子谱学 (XPS).
- 星TCAD模拟用于物理建模设备行为.
主要成果:
- 通过XRD和AFM确认的高晶质β-Ga2O3层.
- 优化的CF4-血治疗有效地抑制了类似于捐赠者的状态,导致超低的离位电流 (1 × 10-9 mA/mm) 和高的开/关比 (10-5).
- 可控制的正值门电压转移到+12.4V,通过调整等离子体持续时间来实现.
- 断裂电压从453V增加到859V,这是由于近表面电荷减少和耗电区域扩大.
- XPS分析证实了F-Ga键的形成和与氧相关的供体缺陷的补偿.
结论:
- 的结合是一种有效的策略,可以使PA-MBE生长的β-Ga2O3中表面状态被动化.
- 通过CF4等离子处理,可以显著改善Ga2O3电源设备的泄漏抑制和故障电压.
- 这项工作清楚地了解了在缺陷调制中的作用,并证明了值电压工程的可行方法.
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