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用于高密度和低噪音的TMR传感阵列的三维异质结合.

Zi'ang Han1,2, Zhenhu Jin1,2, Chenglong Zhang1

  • 1State Key Laboratory of Transducer Technology, Aerospace Information Research Institute, Chinese Academy of Sciences, Beijing, China.

Advanced science (Weinheim, Baden-Wurttemberg, Germany)
|December 26, 2025
PubMed
概括

本研究介绍了一种3D粘合技术,在传感器中将磁道连接密度增加一倍,而不会增加芯片大小. 这种方法有效地抑制低频噪声,增强数据密集型应用的磁传感能力.

关键词:
高密度磁感应阵列的磁感应阵列.低频1 / f抑制噪音的低频1 / f抑制噪音的低频1 / f抑制噪音的低频1 / f抑制噪音的低频1 / f抑制噪音的低频1 / f抑制噪音的低频1 / f抑制噪音的低频1 / f抑制噪音的低频1 / f抑制噪音的低频1 / f抑制噪音的低频1 / f抑制噪音的低频1 / f抑制噪音的低频1 / f抑制噪音增强磁电阻增强磁电阻的方法三维异质整合结合三维异质整合结合挖掘磁阻传感器的道晶圆层级粘合和蚀刻优化优化

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