对混合结合强度测量后裂纹诱导的双杆曲 (PDC-DCB) 方法的分析
Cong Mei1,2, Tianze Zheng1, Qiuhan Hu3
1School of Integrated Circuits, Southeast University, Wuxi 214000, China.
Materials (Basel, Switzerland)
|December 31, 2025
概括
一种新的后结合裂纹双杆曲 (PBC-DCB) 方法精确测量混合结合强度. 这种技术提高了晶圆层级结合评估的准确性和可靠性,克服了现有方法的局限性.
科学领域:
- 材料科学 材料科学 材料科学
- 机械工程 机械工程
- 半导体制造业 半导体制造业
背景情况:
- 对结合强度的定量测量对于混合结合 (HB) 过程和可靠性至关重要.
- 现有的方法,如叶片插入 (BI) 和双悬臂曲 (DCB),由于不精确的裂纹启动,其可重复性和晶圆边缘仅有能力受到限制.
研究的目的:
- 引入一种改进的双悬臂曲 (DCB) 方法,使用后曲裂 (PBC) 进行准确的混合结强度测量.
- 使用新的PBC-DCB方法评估由O2和N2激活的SiCN-SiCN接口的结合强度.
- 通过有限元分析 (FEA) 验证方法的准确性和可靠性.
主要方法:
- 开发和应用后粘合裂纹双杆曲 (PBC-DCB) 技术.
- 在O2和N2激活下测量SiCN-SiCN结合强度.
- 有限元分析 (FEA) 模拟裂传播,并使用优化的粘弹性指数模型验证PBC-DCB方法.
主要成果:
- 通过PBC-DCB方法,高精度 (偏差<3.84%和1.84%) 实现了3.53 J/m2 (O2激活) 和2.93 J/m2 (N2激活) 的结合强度.
- FEA模拟表明,优化的粘弹性指数模型准确地描述了裂传播,模拟精度从16.06%提高到1.77%.
- 与传统的DCB不同,PBC-DCB方法成功地避免了晶圆基板的不必要裂纹,并确保在目标接口上启动裂纹.
结论:
- 在测量混合结合强度方面,PBC-DCB方法提供了显著的进步,提供了卓越的准确性和可重复性.
- 这种技术有效地解决了传统方法的局限性,确保可靠评估晶圆级互连.
- 该研究验证了PBC-DCB方法在关键半导体制造过程中的稳定性和适用性.
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