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添加对液体Al和固体Cu扩散对的凝固的影响

Vigneshwar Hari¹, Stuart D McDonald¹, Xin Fu Tan¹

¹Nihon Superior Centre for the Manufacturing of Electronic Materials (NSCMEM), School of Mechanical and Mining Engineering (SoMME), The University of Queensland, Brisbane, QLD 4072, Australia.

Materials (Basel, Switzerland)

|December 31, 2025

概括

由于其独特的特性,- (Al-Ni) 合金显示出作为制填充剂的前景. 将添加到中限制了铜的可溶性,减少了不相似的Al-Cu接头中的脆性阶段的形成.

科学领域:

材料科学材料科学材料科学
金工业是金工业的一个方面.
固化科学固化科学

背景情况:

- (Al-Ni) 合金具有理想的性能,如高导电性,流动性,热稳定性和强度.
这些特性使得Al-Ni合金适用于新型应用,特别是作为制填充剂.

研究的目的:

为了研究Al-Ni/Cu扩散对中的微观结构和相位形成.
为了比较纯液体和Al-Ni合金与铜基板反应的固化行为.
用数学建模和CALPHAD模拟来验证微观结构观测.

主要方法:

扩散对实验涉及液体 (纯和Al-3at.%Ni) 和铜基板.
使用扫描电子显微镜 (SEM) 和能量分散式X射线光谱 (EDS) 的微结构分析.
实验结果与菲克第二定律建模和CALPHAD (相位图计算) 模拟进行比较.

主要成果:

在凝固的Al-Ni/Cu扩散对中确定了几个独特的相,包括Al7Cu4Ni (τ),Al3(Cu,Ni) 2和Al3Ni.
在液态阶段计算的铜度概况有效地解释了观察到的微观结构特征.
观察到液体Al-3at.%Ni通过降低铜的溶解度来限制脆性Al2Cu (θ) 阶段的生长.

结论:

将添加到中会影响铜固化过程中的相位形成和微观结构.
数学和CALPHAD建模可以准确地预测和解释Al-Ni/Cu系统中观察到的微结构现象.
限制铜在液态Al-Ni合金中的溶解性为制造和铜之间强大的不同接头提供了潜在的好处.

关键词:

-合金是一种合金.卡尔法达 (CALPHAD) 是一个合金合金的使用情况.制制制制制制制铜铜铜铜的铜.扩散扩散是一种扩散.微观结构的微观结构固化的固化过程

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