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使用扫描声学显微镜 (SAM) 评估微电子包装结构完整性的最新进展:一篇评论

Pouria Meshki Zadeh¹, Sebastian Brand², Ehsan Dehghan-Niri¹

¹School of Manufacturing Systems and Networks, Ira A. Fulton Schools of Engineering, Arizona State University, Mesa, AZ 85212, USA.

Sensors (Basel, Switzerland)

|December 31, 2025

概括

扫描声学显微镜 (SAM) 推进了微电子包装的结构完整性评估. 这篇评论强调了SAM的重点.

科学领域:

材料科学与工程材料科学与工程
电气工程电气工程
非破坏性评估/测试 (NDE/T) 是指非破坏性评估/测试.

背景情况:

微电子包装对于半导体芯片保护,电源和互连至关重要,直接影响电子设备的功能和可靠性.
电子设备越来越复杂和微型化,需要先进的检查技术来防止故障.
非破坏性评估/测试 (NDE/T) 方法对于维护微电子系统的完整性至关重要.

研究的目的:

审查扫描声学显微镜 (SAM) 的进展,以评估微电子系统的结构完整性.
突出SAM在应对3D和异质集成架构带来的挑战中的作用.
探索SAM与机器学习和深度学习的集成,用于自动检测缺陷.

主要方法:

专注于扫描声学显微镜 (SAM) 作为一种NDE/T方法.
检查了SAM在多模块堆叠,通过介质 (TSV) 和混合粘合检查方面的技术进步.
审查了SAM与机器学习和深度学习算法的集成,用于缺陷分析.

主要成果:

SAM技术的进步提高了复杂的微电子包的检查灵敏度和分辨率.
新的SAM方法提供横向分辨率和检查深度之间的权衡,满足各种评估需求.
与人工智能集成显著提高了微电子评估中缺陷检测和表征的效率和准确性.

结论:

SAM是确保先进微电子包的可靠性和稳定性的关键工具.
正在进行的SAM开发对于克服3D和异质集成中的检查障碍至关重要.
人工智能增强的SAM承诺未来电子设备的自动化,高效和可靠的缺陷评估.

关键词:

3D-ICs是一个3DIC.扫描声学显微镜扫描声学显微镜人工智能的人工智能是人工智能.不同类型的包装.微电子包装微电子包装非破坏性评价 - 非破坏性评价半导体半导体半导体

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