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Updated: Jul 10, 2026

Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages
08:46

Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages

Published on: April 13, 2016

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透明包装容器的多参数检查平台:针对应力,维度和缺陷检测的系统设计

Huaxing Yu1, Zhongqing Jia1, Chen Guan1

  • 1Shandong Key Laboratory of Optoelectronic Sensing Technologies, National-Local Joint Engineering Laboratory for Energy and Environment Fiber Smart Sensing Technologies, Laser Institute, Qilu University of Technology (Shandong Academy of Sciences), 3501 Daxue Road, Changqing District, Jinan 250353, China.

Sensors (Basel, Switzerland)
|December 31, 2025
PubMed
概括

这项研究引入了制药包装的统一检查平台,整合了应力,维度和缺陷测量. 该系统在包装生产中实现了高精度的质量控制.

关键词:
协调的检查检查协调的检查检查发现缺陷检测检测缺陷检测维度测量是指维度测量的测量.机器学习是机器学习.剩余压力是一种残留压力.

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相关概念视频

Three-Dimensional Analysis of Strain01:29

Three-Dimensional Analysis of Strain

Three-dimensional strain analysis is crucial for understanding how materials deform under stress, particularly in elastic, homogeneous materials. This method employs principal stress axes to simplify complex stress states into more understandable forms. Subjected to stress, a small cubic element within a material either expands or contracts along these axes, transforming into a rectangular parallelepiped. This transformation effectively illustrates the material's deformation. The principal...