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通过3D打印制造的具有无线信号控制功能的电磁 (EM) 超表面

Zhanhong Lin¹, Dongxing Zhang², Wangwang Ding¹

¹Shensi Lab, Shenzhen Institute for Advanced Study, University of Electronic Science and Technology of China, Shenzhen, China.

Microsystems & nanoengineering

|December 31, 2025

概括

本研究介绍了使用一种新型无颗粒导电系统对体积电子电路进行3D打印. 这项技术使得稳定的频率选择性表面 (FSS) 能够提高对电磁波的性能.

科学领域:

材料科学材料科学材料科学
电气工程电气工程
增材制造增材制造增材制造

背景情况:

传统的平面频率选择性表面 (2DFSS) 具有性能限制,发生角度和极化不同.
对于体积电子产品而言,现有的制造方法往往涉及复杂的工艺或基于粒子的导电墨水.
需要先进的制造技术来创建高性能,空间集成的电子元件.

研究的目的:

开发一种新的3D打印技术,用于制造高性能体积电子电路.
引入无颗粒导电系统,用于创建局部化,可控制的导电涂层.
将频率选择面 (FSS) 从平面扩展到体积尺寸 (3DFSS),以改进电磁波操纵.

主要方法:

开发了一种无颗粒导电系统,使用一种非有毒的还原剂功能化的聚合物涂层.
在现场将银减少到定制设计的基板上,以形成高导电性和可控制的涂层.
通过利用开发的导电系统,实现了3D频率选择性表面 (3DFSS) 的制造.
使用等效电路模型 (ECM) 提供了设计指南,用于将3DFSS转换为过响应.

主要成果:

拟议的3DFSS在各种事件角度和极化模式中显示出显著稳定的过性能.
制造的FSS实现了4.4-7.8GHz (54.8%的分数带宽) 的广泛运行带宽,反射系数低于-10dB.
设计的阵列FSS表现出优异的结构紧性和机械强度.
该技术使电磁信号能够跨尺度调制,解决兼容性和信号质量问题.

结论:

新的3D打印技术成功实现了高性能体积电子电路的制造.
与传统的2DFSS相比,无颗粒导电系统和3DFSS方法提供了优越的电磁过特性.
开发的3DFSS技术适合与建筑材料无集成,并为微型通信系统的电磁兼容性提供解决方案.

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