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对微流体技术的审查,用于灵活电子产品的热管理

Mingzi Liu1, Jiahao Sun2, Zuowei Sun1

  • 1Department of Biomedical Engineering, City University of Hong Kong, Kowloon, Hong Kong, China. xingeyu@cityu.edu.hk.

Lab on a chip
|January 7, 2026
PubMed
概括

微流体技术为灵活的电子产品提供先进的热管理,提高性能和用户舒适度. 本综述详细介绍了用于下一代设备有效调节温度的微流体策略.

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相关概念视频

Thermal Stress01:09

Thermal Stress

If the temperature of an object is changed while it is prevented from expanding or contracting, the object is subjected to stress. The stress is compressive if the object expands in the absence of constraint and tensile if it contracts. This stress resulting from temperature change is known as thermal stress. It can be quite large and can cause damage. To avoid this stress, engineers may design components so they can expand and contract freely. For instance, on highways, gaps are deliberately...