:

Yuzi Han1, Wutong Du2, Yonglin Zhang1

  • 1Department of Mechanical and Aerospace Engineering, The Hong Kong University of Science and Technology, Kowloon, Hong Kong, P. R. China.

概括

研究人员开发了一种数据驱动的方法,使用可解释的机器学习来编程微封装的界面聚合. 这使得对受控的封装效率和颗粒特征的定量设计规则成为可能.

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