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Updated: Jan 29, 2026

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
08:21

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies

Published on: March 20, 2015

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分隔控制翻转机的设备和电路协同优化,防止老化向低压应用

Yuexin Zhao1, Jingjing Tan1, Lin Chen1,2

  • 1College of Integrated Circuits and Micro-Nano Electronics, Fudan University, Shanghai 200433, China.

Micromachines
|January 28, 2026
PubMed
概括

这项研究引入了一种新的晶体管级技术,以减少低压分割控制翻转机 (SCFF) 的老化效应. 该方法显著提高了可靠性,并减少了物联网设备等超低功耗应用程序的时间延迟.

关键词:
这就是BTI BTI BTI.在HCI中,我们可以看到HCI.这就是SCFFFF的原因.晶体管老化的情况晶体管级设计的设计.

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