关于微米铜粉-液体金属复合物互连关节的微观结构和性能的研究
Bo Wang1,2, Siliang He2,3, Guopei Zhang4
1East China Institute of Photo-Electron IC, Bengbu 233000, China.
Materials (Basel, Switzerland)
|January 28, 2026
概括
铜复合糊可以为铜互连实现优化低温过渡液相结合 (TLPB). 这种先进的材料实现了高电导率和切削强度,适合高效,高性能电子包装.
科学领域:
- 材料科学 材料科学 材料科学
- 金工业是金工业的一个方面.
- 纳米技术纳米技术
背景情况:
- 使用液体 (Ga) 的低温过渡液相结合 (TLPB) 提供了电子互连的潜力.
- 优化基于Ga的TLPB的微观结构和联合性能仍然是一个重大挑战.
研究的目的:
- 开发和研究用于Cu/Cu互连的铜 (Cu) 粉/液体-Ga复合糊.
- 系统地研究粉颗粒大小和质量分数对关节特性的影响.
主要方法:
- 制造Cu/Ga复合面料,其粉颗粒大小 (10-40μm) 和质量分数 (10-30 wt%) 不同.
- 在不同的粘合条件下 (温度,压力,时间) 评估关节微观结构,电导率和剪切强度.
主要成果:
- 在220°C,5MPa和720分钟的最佳结合下,产生了密集的金属间化合物 (IMC) 微结构 (Cu9Ga4和CuGa2).
- 实现了高电导率 (1.1 × 10^7 S·m^-1) 和剪切强度 (52.2 MPa).
- 即使是快速粘合 (1分钟) 也导致了39.2MPa的剪切强度.
结论:
- 调整复合糊的配方可以协同优化Cu-Ga TLPB接头的电气和机械性能.
- 开发的过程表明了在先进包装中高效,短时间的互连应用的潜力.
相关概念视频
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