低温Ru-Ru混合结合:Ar/H2等离子体和NH4OH协同激活用于超高密度互连
Yufei Bai1, Jia Yang1, Xinze Li1
1State Key Laboratory of Precision Welding & Joining of Materials and Structures, Harbin Institute of Technology, Harbin 150001, China.
ACS applied materials & interfaces
|February 5, 2026
概括
对于先进的电子产品而言,的结合现在可以在低温下实现. 一种新的Ar/H2等离子和NH4OH处理使可靠,高强度的相互连接成为可能,为在集成电路中取代铜铺平了道路.
科学领域:
- 材料科学 材料科学 材料科学
- 半导体制造业 半导体制造业
- 表面化学 表面化学
背景情况:
- (Ru) 是一个有希望的替代铜 (Cu) 超高密度互连在非常大规模集成 (VLSI) 由于其优越的电特性和电迁移电阻.
- 由于Ru的高点和低扩散,低温Ru/透电混合粘合具有挑战性,需要高温和高压的传统粘合方法.
- 在与SiO2等介电材料的水友性结合过程中抑制Ru表面氧化对于可靠的互连至关重要.
研究的目的:
- 开发一种低温表面激活策略,以实现稳固的Ru-Ru和Ru/电介质混合粘合.
- 调查激活过程对Ru表面性能和粘合性能的影响.
- 为了在未来的集成电路应用中,在热循环下证明Ru互连的可靠性.
主要方法:
- 采用了一种协同的表面激活策略,涉及Ar/H2等离子处理,其次是NH4OH浸泡.
- 在激活前和激活后对表面进行了表征,以分析功能组和表面电阻.
- 用机械测试来评估结合强度,包括结合后分析和在-45°C至+125°C之间的1000个热循环.
主要成果:
- 协同激活使Ru-Ru在250°C时强大的结合成为可能,而不会造成表面氧化.
- 在激活后,由于丰富的 -OH和 -NH2 功能群的形成,Ru 表面阻力下降了20%.
- 在1000个热循环后,获得的结合强度超过了12 MPa,表明了高可靠性.
结论:
- 开发的Ar/H2等离子体和NH4OH协同激活路径为低温Ru/电介质混合结合提供了可行的途径.
- 这种方法有助于形成具有高结合强度和可靠性的无空接口,这对于下一代互连至关重要.
- 鲁在后端线 (BEOL) 互连中作为铜替代品具有显著的潜力,用于先进的高密度集成技术.
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