在BGA包装中使用Sn-0.3Ag-0.7Cu-3Bi无接头的Anand模型和有限元分析
Junchen Liu1, Abdullah Aziz Saad1, Yuezong Zheng2
1School of Mechanical Engineering, Universiti Sains Malaysia, Nibong Tebal 14300, Penang, Malaysia.
Materials (Basel, Switzerland)
|February 13, 2026
概括
这项研究调查了电子包装中使用比斯木合锡-银-铜 (Sn-Ag-Cu-Bi) 接接头的热力学可靠性. 有限元分析预测了关键故障点,并估计了疲劳寿命,有助于强大的包装设计.
科学领域:
- 材料科学 材料科学 材料科学
- 机械工程 机械工程
- 可靠性工程可靠性工程
背景情况:
- 低银Sn-Ag-Cu合剂提供了成本效益和改进的机械性能,用于先进的电子包装.
- 在球网阵列 (BGA) 组件中Sn-0.3Ag-0.7Cu-3Bi (SAC0307-3Bi) 接接头的热力学可靠性需要进一步了解.
研究的目的:
- 开发一个全面的框架来评估在循环热负荷下SAC0307-3Bi接接头的机械行为和疲劳耐用性.
- 准确地描述构成参数并预测这些先进接接头的疲劳寿命.
主要方法:
- 使用诺顿爬行定律和虚拟拉力测试进行构成参数校准.
- 使用模拟热循环 (25°C至125°C) 的3D四分之一对称模型进行有限元分析 (FEA).
- 使用赛德模型估计疲劳寿命.
主要成果:
- 确定了压力度与中性点距离 (DNP) 之间的强烈相关性.
- 角关节的芯片侧接口被确定为关键故障地点.
- 在热坡道期间,爬行应变积累以阶段式模式发生,这表明温度灵敏度.
- 据估计,SAC0307-3Bi接接头的疲劳寿命大约为2239个周期.
结论:
- 这项研究提供了一个验证的框架,用于评估Bi-doped Sn-Ag-Cu合剂的热力学可靠性.
- 确定了关键故障位置和机制,为设计更强大的电子包提供了洞察力.
- 这些发现为在苛刻的应用中使用具有成本效益,高性能无剂建立了基准.
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