概括
我们为相变材料 (PCM) 光子设备开发了一种简化制造方法. 这种全电路集成方法使可扩展的,与造厂兼容的可编程光子电路成为可能.
科学领域:
- 光子学和材料科学 材料科学
- 集成光学 集成光学 集成光学
- 半导体设备制造业 半导体设备制造业
背景情况:
- 换相材料 (PCM) 对于可重新配置和不可挥发的光子设备至关重要.
- 现有的PCM光子制造方法往往涉及复杂的,多步骤的光刻和升起过程.
- 需要简化,可扩展和与造厂兼容的集成方法.
研究的目的:
- 提出和演示PCM光子设备的全电路集成方法.
- 通过与共同蚀刻PCM来简化制造过程.
- 评估这种集成方法的性能和可扩展性.
主要方法:
- 在在绝缘体 (SOI) 晶圆上沉积相变材料 (Sb2Se3) 薄膜.
- 同时与层同时对PCM薄膜进行蚀刻.
- 制造一个不平衡的马赫-泽恩德干扰仪 (UMZI) 装置用于相位调节演示.
主要成果:
- 使用Sb2Se3.3.实现了约0.78 dB/mm的低额外传播损失.
- 与选择性集成方法相比,证明了显著更大的调制区域.
- 在UMZI实验中实现了完整的2π多级阶段调制.
结论:
- 全电路集成为PCM光子设备提供了简化和可扩展的制造路线.
- 这种方法与现有的造工艺兼容,为可编程光子电路铺平了道路.
- 证明的低损耗和有效的相模块化突显了这种方法的潜力.
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