Yongjun Huo1,2, Jiaqi Song1, Wenqian Li1

  • 1School of Materials Science and Engineering, Beijing Institute of Technology, Beijing, China.

概括

先进的热管理材料对于小型化,高功率电子产品至关重要. 本综述涵盖陶基板和热接口材料 (TIM),突出 AI/ML 优化热传输和可靠性在下一代包装.