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Updated: Feb 20, 2026

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在纳米削工艺中,Cu/Zr多层中的原子尺度变形机制

Ruihan Li1,2, Xiangchen Li3, Huan Liu4

  • 1Center of Ultra-Precision Optoelectronic Instrumentation Engineering, Harbin Institute of Technology, Harbin, 150001, China.

Journal of molecular modeling
|February 18, 2026
PubMed
概括

分子动力学模拟揭示了痕速度和深度如何影响铜/ (Cu/Zr) 多层. 较高的速度改变了芯片的形成,而深度增加增加了力量和芯片体积,优化了材料应用.

关键词:
在Cu/Zrr.分子动力学分子动力学多层多层的纳米划痕的 纳米划痕

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Metallic Solids

Metallic solids such as crystals of copper, aluminum, and iron are formed by metal atoms. The structure of metallic crystals is often described as a uniform distribution of atomic nuclei within a “sea” of delocalized electrons. The atoms within such a metallic solid are held together by a unique force known as metallic bonding that gives rise to many useful and varied bulk properties.
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